ABB Semiconductors’ HiPak modules are a family of high-power IGBTs in industry standard housings using the popular 190 x 140 mm, 130 x 140 mm and 140 x 70 mm footprints. HiPak modules are the perfect match for demanding highpower applications such as traction, renewable energy (wind, solar), industrial drives and T & D.
ABB’s HiPak modules are available in three standard isolation voltages (4, 6 and 10.2 kVRMS) and a variety of circuit configurations. These modules exclusively use Aluminium Silicon Carbide (AlSiC) base-plate material for good thermal cycling capability and Aluminium Nitride (AlN) isolation with low thermal resistance. This material combination offers an excellent thermal cycling performance thanks to its matched thermal expansion coefficients (CTE). All HiPak modules feature ABB’s advanced Soft Punch Through (SPT and SPT+) chip technology, which combines low-losses with soft-switching performance and record-breaking Safe Operating Area (SOA).
In keeping with ABB’s reputation for offering high-power semiconductors of exceptionally high reliability, the HiPak SPT chips have been optimized for reliable operation under harsh conditions. This has been achieved through smooth switching characteristics – essential in the high-inductance environments of power electronic systems – and through rugged operation (high SOA) as this translates into operational safety margins for the equipment.
Furthermore, the SPT+ chipsets (IGBT and Diode) at 1,700 V and 3,300 V blocking voltages have been improved to operate at higher junction temperatures up to 150 °C in the HiPak modules.
StakPaks are a family of high-power IGBT and diodes press-pack modules in an advanced modular housing that guarantees uniform chip pressure in multiple-device stacks.
Although the most common package for IGBTs is the insulated module, for applications requiring series connection, presspacks are preferred because of the ease with which they can be connected electrically and mechanically in series as well as due to their inherent ability to conduct in the shorted state – an essential feature where redundancy is required.
Since IGBT modules feature multiple parallel chips, there is a challenge – with conventional press-packs – in assuring uniform pressure on all chips. ABB has solved this issue with a patented spring technology.
The StakPak, optimized for series connection, features a modular concept based on submodules fitted in a fibreglass reinforced frame, which allows a flexible realisation of a range of products for different current ratings and IGBT / diode ratios.