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The HiPak modules are high power IGBTs in industry standard housings with the popular 190 x 140 mm footprint. The initial ABB offering is for devices using Aluminium Silicon Carbide (AlSiC) base-plate material for excellent thermal cycling capability as required in traction applications and Aluminium Nitride (AlN) isolation for low thermal resistance.
These products are available as single-switch configuration (IGBT + FW Diode).
HiPak modules are realised with ABB's advanced Soft Punch Through (SPT) chip technology which combines low losses with soft switching performance and rugged Safe Operating Area (SOA).
For downloading and printing of data sheets in PDF format, click on the part numbers.
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