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The HiPak modules are high power IGBTs in industry standard housings with the popular 190 x 140 mm footprint. They are available in three standard isolation voltages (4, 6 and 10.2 kVRMS) and a variety of circuit configurations. These modules exclusively use Aluminium Silicon Carbide (AlSiC) base-plate material for good thermal cycling capability and Aluminium Nitride (AlN) isolation with low thermal resistance. Thanks to its matched thermal expansion coefficients (CTE), this material combination offers an excellent thermal cycling performance. All HiPak modules feature ABB’s advanced Soft Punch Through (SPT and SPT+) chip technology, which combines low-losses with soft-switching performance and record-breaking Safe Operating Area (SOA).
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