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Press-pack IGBT and diode modules

StakPak is a family of high power insulated gate bipolar transistor (IGBT) press-packs and diodes in an advanced modular housing that guarantees uniform chip pressure in multiple-device stacks.

Although the most common package for IGBTs is the isolated module, for applications requiring series connection, press-packs are preferred because of the ease with which they can be connected electrically and mechanically in series and because of their inherent ability to conduct in the shorted state – an essential feature where redundancy is required. Since IGBTs feature multiple parallel chips, there is a challenge - with conventional press-packs - in assuring uniform pressure on all chips. ABB has solved this problem with a patented spring technology.

The StakPak, optimized for series connection, features a modular concept based on sub-modules fitted in a fiberglass reinforced frame, which allows a flexible realisation of a range of products for different current ratings and IGBT/diode ratios.
 
For downloading and printing of data sheets in PDF format, click on the part numbers. 
Part Number VCES (V) IC (A) VCESAT (V) 
typ.
125 °C
VF (V) 
typ.
125 °C
 IGBT-to-diode ratio Housing Plecs model 
5SNA 1300K450300 4500 1300 3.4 2.3 1:1 K  XML
5SNA 2000K450300 4500 2000 3.4 2.4 1:1 K  XML
5SNA 2000K451300 4500 2000 3.65 3.0 2:1 K  XML
5SNA 2000K452300 4500 2000 3.65 3.0 2:1  XML
5SNA 3000K452300 4500 3000 3.65 3.0 2:1 K  XML
5SMA 3000L450300 New 4500  3000 3.1 - 1:0  L  
5SJA 2000L520300 New 5200 2000 3.14 2.51 1:1 (BIGT) L  
5SJA 3000L520300 New 5200  3000 3.13 2.52 1:1 (BIGT) L  


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