40th PCIM Europe 2018, Nuremberg, Germany, 5 to 7 June 2018: Europe’s leading power electronics and applications event - where industry meets science to discuss next generation technologies and systems – hit some big numbers during its three days gathering (see below).
PCIM by numbers
- 23,500 sqm exhibition area
- 506 exhibitors
- 50 percent of exhibitors presented products designed specifically for e-mobility
- Over 11,000 trade visitors
- More than 300 oral and poster presentation
- 800 conference participants from all over the world
ABB was out in force, showcasing pioneering power semiconductors including:
- HiPak2 - TSPT+ IGBT module, 3300 V / 1800 A / 150 °C Enhanced Trench technology
- HiPak2 - SPT++ IGBT module, 6500 V / 1000 A / 150 °C Enhanced Planar technology
- IGCT - integrated gate-commutated thyristors, 4500 V / 4500 A
- Diode - 6" rectifier diode, 8500 V / 7500 A
Another main focus highlighted:
- LinPak phase-leg dual IGBT modules, 1700 V and 3300 V
- Full SiC LinPak - module demonstrators
- 1.7 kV LoPak1 phase leg IGBT module, 1700 V
- 62Pak phase leg IGBT module, 1700 V
At the technology highlight wall, ABB hosted the world premiere of “particle prevention during ultrasonic welding process”, whereby it has been demonstrated that its LinPak modules are produced without any copper particles inside.
ABB further showcased its e-mobility leadership and its partnership with Formula E (the world’s first fully electric international FIA motorsport series) by offering stand visitors the chance to participate in a driving simulator. The virtual reality Formula E experience, offered visitors an unforgettable racing challenge, leaving many exhilarated by the journey.
Exhibitor Forum and technical conference – linking theory to reality
At the Exhibitor Forum, ABB’s Global Product Manager BiMOS, Mr. Raffael Schnell, presented the company’s semiconductor highlights. The presentation, titled “Up to 30 % more current with ABB’s enhanced 3300V trench and 6500V planar IGBTs” attracted much interest. More in depth information was presented at the technical conference with the paper: “The third generation 6.5kV HiPak2 module rated at 1000A and 150°C”.
ABB introduced the new operational Hipak2 module, based on the Enhanced Planar IGBT and Field Shielded Anode diode concepts. Design modifications for both the IGBT and diode were introduced to achieve lower leakage currents and hence an increase in the maximum operating junction temperature. Additionally, the devices have seen a substantial reduction of the termination area, plus an increase of the chip sizes for achieving larger active areas and an improvement in the current rating.
In the poster session ABB discussed the process of particle prevention implemented in its LinPak module design. Interest in this world first ultrasonic welding process technology was high. For more details, please refer to the ‘Technology highlight’ section of this newsletter.
ABB continues to develop the next generation Bipolar devices. A paper at the technical conference covered the new low loss phase control thyristors (PCTs) for medium current UHVDC transmission.
The new generation of 8.5 kV class PCTs in package with 119 mm pole piece features reduced ON-state voltage VT through optimized wafer thickness, resistivity and cathode design. Additionally, dV/dt and tq ratings are improved in the entire range of VT/Qrr values relevant for HVDC and industrial applications.
This device completes ABB’s new generation PCT platform, where PCTs with rating currents of 1.5, 3 and 6 kA give designers the freedom for optimal valve design for HVDC and UHVDC transmission.
With its strong presence at the PCIM, ABB highlighted its latest technological breakthroughs, enabling higher levels of performance in future applications.
PCIM Europe 2019 will take place from 7 – 9 May 2019 at the Exhibition Center Nuremberg, Germany.
“It was a great pleasure to have met lots of our stakeholders this year, we are looking forward to see you at the leading event for the Power Electronics Community in 2019,” says Paul Willi, Global Sales Manager, ABB Switzerland Ltd, Semiconductors.
